Second quarter Taiwan's IC industry output value of 442 million Taiwan dollars

ITRI ​​IEK ITIS plans to publish the second quarter of 2010 (10Q2) China's semiconductor industry review and outlook report, due to the global economy improved, coupled with a relatively low base period reasons, making the second quarter of Taiwan's overall IC industry growth rate The quarterly growth rate has a good performance. In the second quarter of 2010, the total IC industry output value (including design, manufacturing, packaging, and testing) in Taiwan totaled NT$442.2 billion, a 12.8% increase from the previous quarter (10Q1) and a 47.7% increase from the same period last year (09Q2).

Second Quarter Global Semiconductor Industry Overview

According to the data of the World Semiconductor Trade Statistics Group (WSTS), the sales value of the 10Q2 global semiconductor market reached 74.8 billion U.S. dollars, up 7.1% from the previous quarter (10Q1) and 42.6% from the same period of last year (09Q2); the sales volume reached 175.9 billion. Compared with the previous quarter (10Q1), the growth rate was 8.7%, which was 38.0% higher than the same period of last year (09Q2). The ASP was 0.425 USD, which was 1.5% lower than the previous quarter (10Q1) and 3.3% higher than the same period last year (09Q2).

10Q2 US semiconductor market sales value reached 13.7 billion US dollars, 15.3% growth over the previous quarter (10Q1), an increase of 55.5% over the same period last year (09Q2); Japan semiconductor market sales value reached 11.3 billion US dollars, up 4.6% over the previous quarter (10Q1) Compared with the same period of last year (09Q2), it grew by 25.4%; European semiconductor market sales value reached US$9.3 billion, up 1.1% from the previous quarter (10Q1) and 39.8% from the same period of last year (09Q2); Asian semiconductor market sales value reached 40.4 billion. The US dollar rose 6.6% from the previous quarter (10Q1) and 44.7% from the same period last year (09Q2).

According to SEMI's latest order shipment report released in June, the B/B Ratio was 1.19, which was slightly higher than the 1.13 in May, but it has been at 1 for 12 consecutive months. The above standards show that the semiconductor industry continues to maintain its recovery level.

The estimate of the average 3-month global orders for semiconductor equipment manufacturers in North America in June was US$1.685 billion, an increase of 10.5% over the final order amount of US$1.525 billion in May and an increase of 379.0% over the same period of 2009. The amount has risen since August 2006. The highest level. In terms of shipping performance, the average shipment amount for the three months in June was US$1.421 billion, a 5.7% increase from May's 1.345 billion U.S. dollars and 222.7% over the same period of 2009.

In the second quarter of 2010, Taiwan's overall IC industry output value (including design, manufacturing, packaging, and testing) reached NT$442.2 billion, a 12.8% increase from the previous quarter (10Q1) and a 47.7% increase from the same period last year (09Q2). The output value was NT$119.6 billion, an increase of 7.7% from the previous quarter (10Q1) and 28.3% from the same period of last year (09Q2), which represented the growth of the semiconductor sub industry at least.

Manufacturing industry was NT$217.6 billion, a 15.4% increase from the previous quarter (10Q1) and a 59.8% increase from the same period of last year (09Q2). The packaging industry was NT$72.5 billion, which was a 13.3% increase over the previous quarter (10Q1). In the same period (09Q2), the growth rate was 48.0%; the testing industry was NT$32.5 billion, up 14.0% from the previous quarter (10Q1) and 54.8% from the same period of last year (09Q2).

Second Quarter Taiwan IC Industry Overview - Design Industry

Firstly, we observed the IC design industry, the debt crisis in Europe in 2010Q2, and the impact of the Chinese government's crackdown on the cottage, which caused many Taiwanese mobile phone chips, STBs, and wireless Netcom chips to perform poorly, such as MediaTek. Rui Wei, Yang Zhi and so on. However, due to the global sales of iPads, iPhones, tablet PCs, e-books, and low-cost smart phones, the domestic touch ICs, power management ICs, memory control chips, and other manufacturers have seen significant growth in shipments.

The output value of Taiwan's IC design industry in 2010Q2 reached NT$119.6 billion, which represents a growth of 7.7% from 2010Q1. This indicates that as Q2 summer peak season entered 2010Q2, the demand in the end market remained stable. It is estimated that the output value of Taiwan's IC design industry will reach NT$503.2 billion in 2010, an increase of 30.4% year-on-year.

2010Q2 in Taiwan IC design industry major manufacturers dynamics, for MediaTek to establish a technical team, and Japan's largest telecommunications operator NTT DoCoMo cooperation, signed the fourth generation of mobile communications (4G) Long Term Evolution Technology (LTE) technology licensing agreement, strengthen 4G layout. MediaTek already has leading advantages in 2.5G and 2.75G, and has continuously evolved to 3G technologies such as TD-SCDMA and WCDMA. Currently, it is deployed in 4G. Besides WiMAX, it now joins LTE. Future 4G standards will be either WiMAX or LTE wins and is still a winner for MediaTek.

Second Quarter Taiwan IC Industry Overview - Manufacturing

In the IC manufacturing sector, the 2010Q2 Taiwan IC manufacturing output reached NT$217.6 billion. Among them, the foundry's output value reached NT$14.29 billion, which was a 13.7% increase from 2010Q1 and a significant increase of 38.5% from the same period of last year.

Affected by the continued recovery of economic sentiment in Europe, the United States, and emerging markets, the continuous shortage of foundry capacity has caused the persistence of IC shortages in analog ICs, Netcom ICs, and MCUs. The production capacity of 12-inch wafer fabs is still in a tight state. The utilization rate is at a high level of over 90%. Customers are still waiting in line for the supply of production capacity. The wafer foundry companies gradually increase capital expenditures in response to demand.

The output value of DRAM-based IC manufacturing products was 74.7 billion Taiwan dollars, a growth of 18.9% over 2010Q2, and a substantial increase of 126.4% over the same period of last year. This was mainly due to the low base period last year, and DRAM supply and demand remained tight. Taiwanese manufacturers Increased shipments and performance under better prices than expected.

Representing an important leading indicator of future output growth of IC manufacturing industry: The B/B ratio of semiconductor equipment in North America reached 1.19 in June 2010. This indicates that the equipment order value is greater than the value of shipment for the 12th consecutive month, indicating that the international giants continue Increased investment in production capacity, the economy presents the trend of playing.

2010Q2 in the Taiwanese IC manufacturing major manufacturers dynamics, for 2010, TSMC capital spending will surpass Intel. optimistic about the semiconductor market outlook, TSMC's overweight investment, in the July 29 law meeting, announced that the 2010 capital expenditure from the original set of 48 Billion U.S. dollars, increased to 5.9 billion U.S. dollars, surpassing Intel’s 5.2 billion U.S. dollars. Second only to South Korea’s Samsung. Chairman Zhang Zhongmian also revised the 2010 global foundry growth forecast to 40. %.

In the global recovery of the Fabless industry, and the global outsourcing of IDM's semiconductor manufacturing industry, the global wafer foundry 12-inch wafer fab capacity will be tight. If IDM exits semiconductor manufacturing too quickly, the supply of foundry capacity will evolve from the seller's market to the buyer's market. Looking ahead, the global investment in semiconductor wafers will shift from the Memory industry to the Foundry industry.

The second quarter of Taiwan's IC industry overview - sealing and testing industry

In the IC packaging and testing industry, 2010Q2 benefited from the 13.7% growth in the upstream wafer foundry, and the downstream packaging and testing industry also grew. The output value of Taiwanese packaging industry in 2010Q2 was NT$72.5 billion, which was 13.3% higher than 2010Q1 and 48.0% higher than the same period of last year. The output value of 2010Q2 Taiwanese test industry was 32.5 billion NTD, which was 14.0% higher than 2010Q1 and 54.8% higher than the same period of last year. Demand for mobile phone chips and graphics chips was strong and memory shipments continued to flourish, driving the growth of overall output value. In addition, due to the impact of the international gold price surge, the conversion of gold wire to copper wire encapsulation is still a topic of continuous concern for the latter.

2010Q2 in Taiwan IC packaging and testing industry, the dynamics of the main manufacturers, for the force, UMC, Elpida cooperation next year trial production of 28nm process 3D IC chip. The three major plants held a signing ceremony for TSV technology on June 21st. This is a rare cross-industry cooperation in the field of logic and memory technologies in recent years. The three major plants will promote the integration of 3D ICs with 28nm advanced processes and use Elpida. The DRAM technology and UMC's advanced logic technology, together with the packaging technology into a force, to jointly develop Logic IC and DRAM 3D IC heterogeneous integration complete solution.

Under the trend of component specifications such as high-efficiency, high integration, and low power consumption of electronic products, semiconductor manufacturers are no longer just following the development of Moore's Law, 3D ICs have become the future of advanced packaging, the future of Logic IC and Mobile DRAM. Integration, mobile phones will be the largest application market.

Logic ICs such as graphics chips can also be integrated with DRAM to achieve high-speed, high-performance requirements, and future applications will be very broad. Forces, UMC, and Elpida saw the market for the largest block of 3D ICs and have already actively collaborated to hope to take the lead in grabbing the Logic IC and Memory stack markets.

Analysis of major events: Chuangchuang and Maode cooperation entered SDRAM, Taiwan DRAM factory layout non-standard products

ProMOS and niche-type memory company Kontron will form an alliance to build a high-capacity 256Mb DDR2 product for the company's 12-inch wafer fab with a 72nm process. This is Prom's first song in the consumer electronics market. Chuangye also obtained capacity supply in the event of tight SDRAM capacity. ProMOS also uses Elpida 63nm process layout Mobile RAM market, from the 128Mb products cut into, is expected to mass production in the second quarter of 2011, specializing in low-end mobile phone market.

In addition to ProMOS's awareness of the risk of diversification, SANU also plans to deploy Mobile RAM market from Low-Power DDR/DDR2 market, hoping to significantly reduce the proportion of PC-related products. It is expected that it will enter trial production in the third quarter of 2010.

After the financial turmoil, Taiwan’s DRAM factories started to diversify their product line strategy and focused only on the risks of standard DRAM products. Since 2010, DRAM plants have been reported to start deploying non-standard DRAM products, including SDRAM, Mobile RAM, and NAND Flash. , graphics card memory (GDDR) and so on.

For example, the Japanese DRAM maker Elpida began its transformation in 2010, releasing most of the standard DRAM production to Taiwan, while Elpida's production capacity at the Hiroshima plant was fully loaded with Mobile RAM products, and Elpida has already invested in the consumption. Electronic products. Micron has also focused its standard DRAM on the sub-category, and has focused on the layout of NAND Flash and NOR Flash. The diversification of its product lines will become increasingly apparent.

Analysis of major events: Large-scale expansion of Global Foundries will form a strong competitive pressure on UMC

Global Foundries held a press conference in Taiwan for the first time on June 1 to announce a global capacity expansion plan. According to Global Foundries, the global wafer industry has shown a recovery trend in 2010. Since the company acquired Singapore Chartered Semiconductor in 2009, the 12-inch wafer production capacity has surpassed that of the second largest wafer foundry company in the world. The current priority is to integrate them. Germany, Singapore, and the United States have no plans to invest in other fabs.

Global Foundries said that the company’s capital expenditures are expected to reach 2.7 billion to 2.8 billion U.S. dollars in 2010, and about 1.5 billion U.S. dollars in 2011. It is expected that an annual output of 1.6 million 12-inch wafers is expected in 2014. Both Global Foundries and Chartered in Singapore are members of the Common Platform. The merger of the two companies will facilitate the integration of manufacturing capacity within the alliance and seek outsourcing orders for IDM vendors.

The combined Global Foundries, through the strong support of ATIC funds from major shareholders, has expanded its 12-inch wafer fab capacity. Under the advantages of ATIC funds and IBM Common Platform technology, it has formed strong competition for UMC in Taiwan. In the future, the second and third largest market share of global professional foundry market will become increasingly fierce.

Analysis of major events: South Korea’s Hynix and China’s Taiji Industry have established a joint venture memory and sealing factory “Haitai Semiconductor”

Haitai Semiconductor is a joint venture between Wuxi Taiji Industry and Korea Hynix, with a total investment of US$350 million. It focuses on probe testing and packaging of semiconductor products. The company plans to use 1G DRAM as the main product, with a capacity of 75 million cells per month for packaging and testing, and annual sales of 300 million U.S. dollars. The integrated circuit industry in Wuxi has formed a complete industrial chain including wafer design, wafer fabrication, packaging and testing, germanium single crystal materials, epitaxial wafers, and masks.

Following the joint venture between Japan’s IDM Toshiba and mainland Nantong Fujitsu to establish the “Wuxi Tongzhi Company,” a joint venture with Hynix to establish a memory packaging and testing plant “Haitai Semiconductor”. Through a joint venture with major international companies, the mainland has actively introduced advanced technologies and demonstrated its intention to develop advanced high-level packaging and testing technologies.

Hynix and ST already have a 12-inch memory fab in Wuxi, mainland China. The monthly production capacity is 40,000, and the process technology is 90-45nm. The establishment of Haitai Semiconductor will create a one-stop production method for Hynix in China. , save production and logistics costs, and further increase the cost advantage. If the mainland obtains advanced technology through cooperation with international companies, which in turn will promote the technological upgrading and transformation of the local packaging and testing industry, it will pose a threat to the global competitiveness of the Taiwanese packaging industry in the future.

Future outlook

In the second half of 2009, the global semiconductor industry was affected by the national government's economic revitalization program, which led to a significant growth in global semiconductor sales compared to the first half of 2009. In the first half of 2010, the pace of global economic recovery was better than expected, coupled with insufficient capacity, which also made sales performance in the first half of this year show a bright performance. Therefore, it is estimated that the annual growth rate and quarterly growth rate in the third quarter will be affected by the high base period and weaken the growth.

Although industry growth will slow down, the shortage of supply of foundry and packaging and testing capacity will continue. This can be confirmed by the fact that domestic semiconductor manufacturers have announced a substantial increase in capital expenditure.

Looking into the third quarter, the IC design industry estimates that the output value of Taiwan's IC design industry in 2010Q3 will reach NT$137.5 billion, a 15.0% increase from 2010Q2. As Taiwan’s IC design industry has gradually entered a steady growth cycle, the third and fourth quarter will still be In the traditional peak season, it is expected that in the future, driven by demand from PCs, NBs, LCD TVs, and mobile phones, the output value will reach NT$503.2 billion in 2010, and the annual growth rate will reach 30.4%, far exceeding the 2.9% in 2009.

In the IC manufacturing sector, the output value of Taiwan's IC manufacturing industry in 2010Q3 is expected to reach NT$229 billion, which is 5.2% higher than 2010Q2. Since the base period in the first half of 2010 was already high, and since the third quarter of last year, it gradually rose to the pre-crisis financial crisis. The level of output value will make the trend of the quarterly cost and annual growth of Taiwan's IC manufacturing industry in the second half of 2010. Third, the four seasons will still be the traditional peak season. It is expected that in the future driven by the demand for terminal 3C products, the output value in 2010 will reach NT$680.8 billion, and the annual growth will reach 50.8%.

Finally, in the IC packaging and testing industry, it is estimated that the 2010Q3 packaging and testing industry will enter the traditional peak season, but the base period in the first half of the year has been boosted, and the packaging and testing industry revenue will grow by 5.0% and 6.2% respectively compared with 2010Q2. The 2010 package and test are estimated. The output value reached NT$289.6 billion and NT$130.6 billion, respectively, which grew to 45.1% and 49.1% respectively.