The IC design community lacks killer applications this year, and performance is generally at a historical low. However, with the rise of smart handheld devices and Ultrabook, wireless communication related ICs such as WiFi, Near Field Communication (NFC), stored solid state drives (SSD), and touch Business opportunities such as panels will become the new savior of the IC design industry.
In the past, MediaTek has been sweeping the global market for 2G mobile phone baseband products, and its operation reached a peak. However, with the backwardness of 3G chip layout, the operation has been deteriorating rapidly in recent years. However, after smart phones replace functional mobile phones, low-priced smart phones or smartphone-like chips Become a new battlefield for mobile phone chip makers in Taiwan.
MediaTek 3.75G smart phone chip MT6573 gradually demonstrated its success in the mainland market. In addition to being adopted by the Lenovo A60, it will also launch the successor MT6575 next year. Huawei has adopted this IC in the market. MediaTek also adopted Vodafone in smart phones.
As MediaTek and Lenovo cooperated with the smart phone A60 in sales in the mainland market, and 3G mobile phone chip customers have reached 2 digits, MediaTek will continue to attack emerging market opportunities in the future. The Morningstar is also optimistic about 2G mobile phone business opportunities in emerging markets, in the third quarter of this year has launched a new version of the smart phone chip 8536N, for China's white mobile phone to enter the emerging market choice, and the rumored Morningstar will launch before the end of the 2.75G and 3.75G Smartphone chips have the opportunity to enter the Nokia supply chain.
In addition to mobile phone chips, WiFi and NFC derived from smart handheld devices are also the focus of attention in the IC design industry. According to a survey conducted by research institute Garnter, the future application of WiFi chips will be expanded to new applications such as personal cloud and smart networking. It is estimated that the demand in 2015 will grow from 800 million last year to 3 billion. It is worth noting that after 2013, the 802.11ac specification will become the new mainstream of WiFi applications in the PC field, and will be further expanded to mobile phones, tablet computers, etc. In addition to Realtek, MediaTek will also benefit from MediaTek's merger with Ralink.
In the NFC segment, the domestic IC design and design service company, Liwang, has already laid out its position on the silicon intellectual property. With the e-purse, it has gradually built up the trend of smart phones, which will gradually contribute to the operation. In addition, Ultrabook is expected to take off next year. The group control and module factories of the memory control ICs will have the opportunity to benefit from SSD business opportunities. As far as touch applications are concerned, such as Ruiya and Qi Li, they also have imaginary themes.
In the past, MediaTek has been sweeping the global market for 2G mobile phone baseband products, and its operation reached a peak. However, with the backwardness of 3G chip layout, the operation has been deteriorating rapidly in recent years. However, after smart phones replace functional mobile phones, low-priced smart phones or smartphone-like chips Become a new battlefield for mobile phone chip makers in Taiwan.
MediaTek 3.75G smart phone chip MT6573 gradually demonstrated its success in the mainland market. In addition to being adopted by the Lenovo A60, it will also launch the successor MT6575 next year. Huawei has adopted this IC in the market. MediaTek also adopted Vodafone in smart phones.
As MediaTek and Lenovo cooperated with the smart phone A60 in sales in the mainland market, and 3G mobile phone chip customers have reached 2 digits, MediaTek will continue to attack emerging market opportunities in the future. The Morningstar is also optimistic about 2G mobile phone business opportunities in emerging markets, in the third quarter of this year has launched a new version of the smart phone chip 8536N, for China's white mobile phone to enter the emerging market choice, and the rumored Morningstar will launch before the end of the 2.75G and 3.75G Smartphone chips have the opportunity to enter the Nokia supply chain.
In addition to mobile phone chips, WiFi and NFC derived from smart handheld devices are also the focus of attention in the IC design industry. According to a survey conducted by research institute Garnter, the future application of WiFi chips will be expanded to new applications such as personal cloud and smart networking. It is estimated that the demand in 2015 will grow from 800 million last year to 3 billion. It is worth noting that after 2013, the 802.11ac specification will become the new mainstream of WiFi applications in the PC field, and will be further expanded to mobile phones, tablet computers, etc. In addition to Realtek, MediaTek will also benefit from MediaTek's merger with Ralink.
In the NFC segment, the domestic IC design and design service company, Liwang, has already laid out its position on the silicon intellectual property. With the e-purse, it has gradually built up the trend of smart phones, which will gradually contribute to the operation. In addition, Ultrabook is expected to take off next year. The group control and module factories of the memory control ICs will have the opportunity to benefit from SSD business opportunities. As far as touch applications are concerned, such as Ruiya and Qi Li, they also have imaginary themes.
An Rf Combiner is used to combine RF from a number of different sources. This is achieved while maintaining the characteristic impedance of the system. Dependent upon the type of combiner it may introduce additional loss by using resistors, or it may be use transformers in which case it could in theory be lossless.
RF combiners can be used in a number of different applications. They are used for sending several signals along a single feeder, and they may also be used for circuits where several RF signals need to be brought together."
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