Silicon Product Intellectual Property (SIP) platform solutions and digital signal processor (DSP) core licensee CEVA announced that Intel Corp. (Intel CorporaTIon) has been authorized to use CEVA-XC communication DSP cores.
Gideon Wertheizer, CEO of CEVA, said: "We are honored that Intel has chosen CEVA's flagship product, CEVA-XC DSP. By using CEVA technology, industry leaders such as Intel can immediately support the most advanced and demanding wireless standards."
CEVA-XC is a high-performance, scalable, low-power communication DSP core designed for 4G terminals and wireless infrastructure. It can support multiple wireless protocols in the form of software radio, including LTE, TD-LTE, WiMAX 16m, HSPA ++, HSPA, TD-SCDMA, GSM and CDMA. CEVA-XC further expands the market-recognized CEVA-X series DSP core market. To date, the CEVA-X series has been authorized for use by more than 25 industry leaders. The authorized party has produced more than 100 million chips with CEVA technology as the core.
About CEVA
CEVA is a leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for mobile phones, mobile handheld devices and consumer electronics. CEVA's intellectual property portfolio includes a wide range of technologies for cellular baseband (2G / 3G / 4G), high-definition (HD) video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA) . In 2009, CEVA authorized parties produced more than 330 million chips with CEVA technology as the core, including seven of the eight top mobile phone OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE.
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