The company has been importing silica gel from the beginning of the United States, Germany, Japan and other independent research and development of LED silica gel. The main products include high-power lens-filled silica gel, Moding silica gel, SMD silica gel and so on.
The LED optoelectronic silicone materials supplied by Jieguo Electronics are available in the low-refraction series of methyl type, high-fold series of phenyl resin type and high-refractive-denatured resin type.
Among them, the low-refraction series products cover high-power LED lens filling, high-power modular package, high-power integrated light source, COB light source, and patch (flat) LED package; high-refractive phenyl resin products are mainly used in phosphors. Hybrid and integrated light source, COB light source, SMD LED and other flat-type high-end LED packages; high shading modified resin is mainly used in flat-type high-end LED product packaging such as SMD LED.
Chen Yongsheng said that the company first chose to work hard on raw materials. In order to take care of the needs of various positioning packaging customers, Jieguo Electronics' own brand glue is also divided into high, low and medium end. The raw materials of high-end glue are all imported raw materials, and then molecular design and synthesis. Low-end products (such as some filled rubber products) use domestic raw materials, and they are also put into production after strict screening and multiple tests.
Jieguo Electronics, which is praised by the industry peers as the "leader of LED silicone industry", is the earliest enterprise in China to develop and produce LED silica gel. Based on continuous improvement of existing products, the company has developed a series of modified silicones, which will be unveiled at the High-tech LED Lighting Exhibition held at the Guangzhou Poly Exhibition Hall on November 25.
(Jieguo Electronics High-Fold Resin) 
(Jieguo Electronics SMD package with low-profile silicone)
HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 µm circuit geometries
30 µm dielectric layers
50 µm laser vias
125 µm bump pitch processing
Applications
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
HDI PCB
HDI PCB,Special HDI PCB,HDI Prototype PCB,HDI Board PCB
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